Bengaluru: izmo Ltd. has received formal recognition from the Department of Scientific and Industrial Research (DSIR), Government of India, for its in-house Research and Development (R&D) unit.
This milestone reinforces izmo’s leadership in advanced semiconductor packaging and its commitment to pioneering innovations in silicon photonics – a critical enabler for next-generation computing and communication technologies.
izmo Strengthens R&D Leadership with DSIR Recognition
Through its semiconductor division, izmo Microsystems, the company has invested substantially in R&D programs focused on silicon photonics packaging.
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With advanced design engineering and precision integration capabilities, the company operates a world-class cleanroom facility in Bengaluru, supporting research across RF, MEMS, power, and photonics packaging. These investments have propelled izmo Microsystems into the global forefront of semiconductor packaging and integration innovation.
Sanjay Soni, Managing Director of izmo Ltd., said, “The DSIR recognition is a testament to our continued focus on semiconductor packaging excellence and our pioneering work in silicon photonics. As AI, cloud, and data center needs accelerate globally, our objective is to drive India’s leadership in advanced packaging technologies that underpin the future of computing.”
Silicon Photonics: A Key Focus Area for Future Growth
Silicon photonics is revolutionizing the semiconductor industry by using light to transfer data at ultra-high speeds, offering significant improvements in bandwidth, latency, and power efficiency.
This technology underpins high-performance computing, AI infrastructure, and hyperscale data centers that demand rapid and reliable data transmission.
Market research estimates the global silicon photonics industry to grow from USD 2.65 billion in 2025 to over USD 9 billion by 2030, with a CAGR exceeding 25%. Packaging innovations are pivotal to realizing this growth, ensuring integration and scalability for large-scale deployment.
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Vision for India’s Semiconductor Future
With DSIR recognition, izmo Ltd. will be able to leverage government support to further accelerate R&D initiatives, attract partnerships, and expand its footprint in the global semiconductor ecosystem. The company aims to solidify its role as a key contributor to India’s technological advancement in semiconductor packaging and photonics research.
izmo Ltd., through its semiconductor division izmo Microsystems, is India’s first specialist in silicon photonics packaging and advanced System-in-Package (SiP) manufacturing.
The company offers custom IC and SiP packaging, high-reliability RF/MW solutions, co-packaged optics, and EV/green energy power modules from its state-of-the-art cleanroom facility in Bengaluru.
Combining engineering expertise with global collaborations, izmo Microsystems delivers solutions for AI infrastructure, telecommunications, aerospace, and green energy sectors, aligned with the Make in India vision.
